Pattern formation method, processed substrate manufacturing method, optical component manufacturing method, circuit board manufacturing method, electronic component manufacturing method, imprint mold manufacturing method

摘要

A layer of a curable composition (A1) containing a component (a1) that is a polymerizable compound is disposed on the surface of the substrate, and at least a component (a2) that is a polymerizable compound is placed on the layer of the curable composition (A1). ) Containing the curable composition (A2) is discretely dropped, and a mixed layer of the curable composition (A1) and the curable composition (A2) is provided between the mold having the pattern and the substrate. The curable composition (A1) except that the mixed layer is cured by irradiation with light, the mold is separated from the cured mixed layer, a pattern is formed on the substrate, and the solvent is removed. The contact angle of the composition of the component with respect to the mold surface is 10 ° or less.