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Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
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机译:具有拉应力的封装半导体器件以及制造具有拉应力的封装半导体器件的方法
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摘要
An assembled semiconductor device and a method of making an assembled semiconductor device are disclosed. In one embodiment the assembled device includes a carrier having a first thickness, a connection layer disposed on the carrier and a chip disposed on the connection layer, the chip having a second thickness, wherein the second thickness is larger than the first thickness.
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