首页> 外国专利> Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure

Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure

机译:多孔质体的制造方法,多孔质体,制造装置的方法,装置,布线构造体的制造方法以及布线构造体

摘要

Provided are a method of manufacturing a porous body capable of easily manufacturing a porous body, a porous body, a method of manufacturing a device, a device, a method of manufacturing a wiring structure, and a wiring structure.;A photocurable composition including a condensing gas and a polymerizable compound is applied to a substrate or a mold, the photocurable composition is sandwiched between the substrate and the mold and then the photocurable composition is irradiated with light to cure the photocurable composition, and the mold is released from a surface of the cured photocurable composition.
机译:本发明提供一种能够容易地制造多孔质体的多孔质体的制造方法,多孔质体,装置的制造方法,装置,配线结构的制造方法以及配线结构。将冷凝气体和可聚合化合物施加到基材或模具上,将光固化性组合物夹在基材和模具之间,然后用光照射该光固化性组合物以固化该光固化性组合物,然后从模具的表面脱模。固化的光固化性组合物。

著录项

  • 公开/公告号US10373863B2

    专利类型

  • 公开/公告日2019-08-06

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORPORATION;

    申请/专利号US201715468911

  • 发明设计人 YUICHIRO GOTO;TADASHI OOMATSU;

    申请日2017-03-24

  • 分类号H01L23/52;H01L21/768;H01L21/027;H01L21/3205;H01L23/532;B29C44/02;B29C44/12;H01L21/02;H01L23/522;H01L23/528;B29C37;B29K33;B29K105;B29L31/34;B29K105/04;

  • 国家 US

  • 入库时间 2022-08-21 12:13:49

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