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Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using high pressure solvent
Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using high pressure solvent
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机译:用高压溶剂剥离临时粘接的载体-工件对的方法
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摘要
A method of debonding a temporarily adhesive-bonded carrier-workpiece pair employs a stream of a solvent at a high pressure. The carrier and the workpiece are bonded with an adhesive that is dissolvable in a selected solvent. The workpiece such as a device wafer may have been thinned and processed. The solvent is applied to the adhesive at a high pressure to debond and dissolve the adhesive with high throughput. The dissolved adhesive can be recycled and later reused, thus lowering the cost of the whole bonding and debonding process.
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