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Method for forming a lateral super-junction MOSFET device and termination structure

机译:形成横向超结型MOSFET器件的方法和终端结构

摘要

A method for forming a lateral superjunction MOSFET device includes forming a semiconductor body including a lateral superjunction structure and a first column connected to the lateral superjunction structure. The MOSFET device includes the first column to receive current from the channel when the MOSFET is turned on and to distribute the channel current to the lateral superjunction structure functioning as the drain drift region. In some embodiment, the MOSFET device includes a second column disposed in close proximity to the first column. The second column disposed near the first column is used to pinch off the first column when the MOSFET device is to be turned off and to block the high voltage being sustained by the MOSFET device at the drain terminal from reaching the gate structure. In some embodiments, the MOSFET device further includes termination structures for the drain, source and body contact doped region fingers.
机译:用于形成横向超结MOSFET器件的方法包括形成半导体本体,该半导体本体包括横向超结结构和连接到该横向超结结构的第一柱。 MOSFET器件包括第一列,其在MOSFET导通时从沟道接收电流,并将沟道电流分配到用作漏极漂移区的横向超结结构。在一些实施例中,MOSFET器件包括紧邻第一列设置的第二列。设置在第一列附近的第二列用于在MOSFET器件关闭时夹断第一列,并阻止MOSFET器件在漏极端子处承受的高电压到达栅极结构。在一些实施例中,MOSFET器件还包括用于漏极,源极和体接触掺杂区指的终端结构。

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