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Warpage compensation metal for wafer level packaging technology
Warpage compensation metal for wafer level packaging technology
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机译:晶圆级封装技术的翘曲补偿金属
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摘要
A wafer level package device and method are disclosed that include a warpage compensation metal adhered to a backside of a semiconductor wafer for minimizing warpage of the semiconductor wafer, where multiple metal features have been formed on the device side of the semiconductor substrate. The warpage compensation metal may include a copper film.
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