首页> 外国专利> Termination Design For Trench Superjunction Power MOSFET

Termination Design For Trench Superjunction Power MOSFET

机译:沟道超结功率MOSFET的端接设计

摘要

A plurality of trench stripes are disposed in parallel in an epitaxial layer on a drain and extends from a top region to a bottom region of a first surface of the semiconductor. A first polysilicon layer is in each of the trench stripes. The first polysilicon layer extends between the drain and the first surface proximal to the top region and the bottom region, and between the drain and a level below the first surface in a middle region between the top region and the bottom region. A second polysilicon layer is over the first polysilicon layer in the middle region, wherein the first poly silicon layer forms a shield, and the second polysilicon layer forms a gate. A source is in a silicon mesa stripe surrounding the first trench stripe.
机译:多个沟槽带在漏极上的外延层中平行布置,并且从半导体的第一表面的顶部区域到底部区域延伸。第一多晶硅层在每个沟槽带中。第一多晶硅层在漏极和邻近顶部区域和底部区域的第一表面之间,以及在漏极和在顶部区域和底部区域之间的中间区域中的第一表面下方的水平之间延伸。第二多晶硅层在中间区域中的第一多晶硅层上方,其中第一多晶硅层形成屏蔽,第二多晶硅层形成栅极。源极在围绕第一沟槽条纹的硅台面条纹中。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号