首页> 外国专利> Decorative Multi-Layer Surfacing Materials Having Embedded Conductive Materials, Solid Surfaces Made Therewith, Methods for Making Such Surfacing Materials and Uses Therefor

Decorative Multi-Layer Surfacing Materials Having Embedded Conductive Materials, Solid Surfaces Made Therewith, Methods for Making Such Surfacing Materials and Uses Therefor

机译:具有嵌入式导电材料的装饰性多层饰面材料,用其制成的固体表面,制造此类饰面材料的方法及其用途

摘要

Decorative, multi-layer surfacing materials, surfaces made therewith, methods of making such and wireless power transmission using the same, which surfacing materials comprise: a first resin-impregnated paper layer and a second resin-impregnated paper layer, and a first conductive material having a first terminus and a second terminus and capable of carrying an electric current from the first terminus to the second terminus; wherein the first conductive material is disposed on a first surface of the first resin-impregnated paper layer; wherein the first resin-impregnated paper layer and the second resin-impregnated paper layer are disposed in a stacked and compressed such that the first conductive material is encapsulated between the first resin-impregnated paper layer and the second resin-impregnated paper layer; and wherein at least one of the first resin-impregnated paper layer, the second resin-impregnated paper layer or an optional additional resin-impregnated paper layer is a decorative layer.
机译:装饰性多层表面材料,用其制成的表面,其制造方法以及使用该材料的无线电力传输,该表面材料包括:第一树脂浸渍纸层和第二树脂浸渍纸层,以及第一导电材料具有第一末端和第二末端,并且能够从第一末端向第二末端输送电流;其中,第一导电材料设置在第一树脂浸渍纸层的第一表面上;其中,第一树脂浸渍纸层和第二树脂浸渍纸层被堆叠并压缩,使得第一导电材料被封装在第一树脂浸渍纸层和第二树脂浸渍纸层之间;并且其中第一树脂浸渍纸层,第二树脂浸渍纸层或可选的附加树脂浸渍纸层中的至少一个是装饰层。

著录项

  • 公开/公告号US2019198224A1

    专利类型

  • 公开/公告日2019-06-27

    原文格式PDF

  • 申请/专利权人 THE DILLER CORPORATION;

    申请/专利号US201816157568

  • 发明设计人 KEVIN OBRIEN;BRYCE COLE;

    申请日2018-10-11

  • 分类号H01F27/28;H01F5;B32B29;H01F27/24;H01F38/14;H02J5;H01F41/04;H02J7/02;H02J7;

  • 国家 US

  • 入库时间 2022-08-21 12:07:45

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