PCB BOARD DESIGN METHOD FOR AVOIDING SURFACE ELEMENT TOMBSTONING, AND PACKAGING METHOD AND PCB BOARD

摘要

The present invention belongs to the field of PCB packaging technologies and discloses a PCB board design method for avoiding surface element tombstoning, and a packaging method and PCB board. The technical issue to be solved is: the issue in the prior art in which during reflow soldering, the melting of a solder paste at a copper sheet end is slower than that at a copper line end, such that the end where the solder paste melts faster has stronger adhesion to a surface element (8) which causes the other end of the surface element to pull away, leading to tombstoning. The employed technical solution is: providing at least one surface element placement region (2) on a PCB board (1), wherein each surface element placement region has pads (3) provided therein, and there are two pads in each group and the two pads are arranged side by side; establishing a pad limit region (4) on the periphery of the pads; and soldering the surface element to the PCB board via reflow soldering. The method can be used to effectively prevent tombstoning from occurring to a surface element, and also to improve design efficiency, reduce a work amount of manual operations for an engineer and lower error rates.