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METHOD FOR MANUFACTURING BPS-TYPE ARRAY SUBSTRATE AND BPS-TYPE ARRAY SUBSTRATE

机译:BPS型阵列基板和BPS型阵列基板的制造方法

摘要

The present invention provides a method for manufacturing a BPS-type array substrate and a BPS-type array substrate. The method for manufacturing the BPS-type array substrate of the present invention comprises, using a double-layer photoresist structure formed by a first photoresist layer and a second photoresist layer to jack up a main liner portion and an auxiliary liner portion of a main spacer and an auxiliary spacer, respectively, such that the main liner portion and the auxiliary liner portion protrude obviously, such that the thickness of the main spacer and the auxiliary spacer itself is therefore reduced, thereby reducing the amount of BPS material used for forming the main spacer and the auxiliary spacer, reducing the production cost; the height difference between the main spacer and the auxiliary spacer can be realized by thinning the thickness of the first color resist layer under the auxiliary liner portion by means of a half-exposure process, and the manufacturing method is simple.
机译:本发明提供一种用于制造BPS型阵列基板和BPS型阵列基板的方法。本发明的BPS型阵列基板的制造方法包括:使用由第一光致抗蚀剂层和第二光致抗蚀剂层形成的双层光致抗蚀剂结构顶起主间隔物的主衬里部分和辅助衬里部分。因此,主衬里部分和辅助衬里部分明显突出,从而减小了主衬里和辅助衬里本身的厚度,从而减少了用于形成主衬里的BPS材料的量。垫片和辅助垫片,降低了生产成本;通过利用半曝光工艺使在辅助衬里部分下面的第一色阻层的厚度变薄,可以实现主间隔物和辅助间隔物之间​​的高度差,并且制造方法简单。

著录项

  • 公开/公告号WO2019200819A1

    专利类型

  • 公开/公告日2019-10-24

    原文格式PDF

  • 申请/专利号WO2018CN104504

  • 发明设计人 DENG ZHUMING;

    申请日2018-09-07

  • 分类号G02F1/1335;G02F1/1339;G02F1/1362;

  • 国家 WO

  • 入库时间 2022-08-21 11:52:47

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