首页> 外国专利> Apparatus for material deposition on a substrate in a vacuum deposition process, system for sputter deposition on a substrate, and method for manufacturing an apparatus for material deposition on a substrate

Apparatus for material deposition on a substrate in a vacuum deposition process, system for sputter deposition on a substrate, and method for manufacturing an apparatus for material deposition on a substrate

机译:用于在真空沉积工艺中将材料沉积在基板上的设备,用于在基板上进行溅射沉积的系统以及制造用于在基板上进行材料沉积的设备的方法

摘要

The present disclosure provides apparatus for material deposition on a substrate in a vacuum deposition process. The apparatus includes a target support, two or more target segments supported by the target support, a first gap being provided between adjacent target segments of two or more target segments, and two or more bonding layer portions, Each bonding layer portion of the at least two bonding layer portions bonds the respective target segment of the at least two target segments to the target support portion and the bonding layer portions of adjacent target segments are separated from each other by a second gap greater than the first gap .
机译:本公开提供了用于在真空沉积工艺中将材料沉积在基板上的设备。该设备包括目标支撑物,由目标支撑物支撑的两个或更多个目标片段,在两个或更多个目标片段的相邻目标片段之间提供第一间隙,以及两个或更多个粘结层部分,至少一个的每个粘结层部分。两个结合层部分将至少两个目标片段中的各自的目标片段结合到目标支撑部分上,并且相邻的目标片段的结合层部分彼此分开大于第一间隙的第二间隙。

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