STEPPED HOLE MACHINING APPARATUS FOR HI-FIX SUBSTRATE WITH IMPROVED MACHINING ACCURACY AND STEPPED HOLE MACHINING METHOD FOR HI-FIX SUBSTRATE USING SAME

摘要

The present invention relates to a stepped hole machining apparatus for a hi-fix substrate with improved machining accuracy. The stepped hole machining apparatus for a hi-fix substrate with improved machining accuracy comprises: a bush member provided on one side of a body to be movable in the vertical direction, and having a through hole formed in the center thereof; a drill part installed inside the bush member to be vertically movable and led in or out of the bush member in the inner and outer direction of the same through the through hole; a reference block fixedly installed on one side of the bush member; a movable block having one side connected to one side of the drill part to move vertically together with the drill part when the drill part vertically moves; a detecting unit detecting a relative position of the movable block on the basis of the reference block when an end portion of the drill part is disposed at a preset setting position; and a control unit setting a machining reference value based on the distance between an initial position of the movable block and the relative position, and controlling the operation of the drill part according to the set machining reference value. According to the present invention, the relative position of the movable block can be detected on the basis of the reference block to automatically set the depth of a groove machined by a drill tool, thereby significantly improving machining quality and reducing working hours.;COPYRIGHT KIPO 2019