首页> 外国专利> Apparatus for Attaching Substrate and Method for Manufacturing Attached Substrate using the same

Apparatus for Attaching Substrate and Method for Manufacturing Attached Substrate using the same

机译:用于附着基板的设备和使用该设备的附着基板的制造方法

摘要

The present invention relates to a method of manufacturing a display device, which comprises a chamber unit in which a process for attaching a carrier substrate to a substrate for manufacturing a display device is performed, a first plate for supporting the substrate, and a first region of the carrier substrate And a support portion for contacting the second region other than the first region to the substrate supported on the first support plate. The present invention relates to a bonding apparatus for a display device, According to the present invention, it is possible to prevent the substrate from being damaged during the process of manufacturing the display device by attaching the carrier substrate to the substrate, and by preventing the substrate from being damaged during the process of attaching the carrier substrate to the substrate, The quality of the display device can be improved.
机译:显示装置的制造方法以及显示装置的制造方法技术领域本发明涉及一种显示装置的制造方法,其包括:腔室单元,在该腔室单元中进行将载体基板附着于基板的工序,该基板单元支撑基板的第一板;以及第一区域载体基板的支撑部和用于使除第一区域以外的第二区域与支撑在第一支撑板上的基板接触的支撑部。技术领域本发明涉及一种用于显示装置的接合装置,根据本发明,可以通过将载体基板附着到基板上并通过防止基板的损坏来防止在显示装置的制造过程中基板的损坏。在将载体基板附接到基板的过程中,基板不会被损坏,可以提高显示装置的质量。

著录项

  • 公开/公告号KR101990854B1

    专利类型

  • 公开/公告日2019-06-19

    原文格式PDF

  • 申请/专利权人 엘지디스플레이 주식회사;

    申请/专利号KR20120054532

  • 发明设计人 이대훈;오재영;권기현;

    申请日2012-05-23

  • 分类号G02F1/13;H01L51/56;

  • 国家 KR

  • 入库时间 2022-08-21 11:48:18

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