首页> 外国专利> APPARATUS AND METHOD FOR MEASURING PERFORMANCE DEGRADATION RESULTED BY TOTAL IONIZING DOSE EFFECT ON INTEGRATED CIRCUIT USING FULLY-DEPLETED SILICON-ON-INSULATORPROCESS

APPARATUS AND METHOD FOR MEASURING PERFORMANCE DEGRADATION RESULTED BY TOTAL IONIZING DOSE EFFECT ON INTEGRATED CIRCUIT USING FULLY-DEPLETED SILICON-ON-INSULATORPROCESS

机译:用全耗尽型绝缘硅工艺测量整体电路上电离剂量效应对整体电路造成的性能下降的装置和方法

摘要

The present invention relates to an apparatus and a method for measuring performance deterioration of an integrated circuit using a complete deletion mode silicon-on-insulator process caused by a total ionization dose effect. The apparatus for measuring circuit performance deterioration caused by a total ionization dose effect includes: a first inverter; an N^th inverter directly connected to the first inverter or indirectly connected to the first inverter through at least one different inverter; and a switch selectively connecting the first inverter to any one of external and the N^th inverter. The first inverter may include: a controlled stress transistor; an uncontrolled stress transistor connected to the controlled stress transistor in series; a transfer gate transistor selectively connecting the uncontrolled stress transistor to an IN node; a stress mode biasing transistor performing biasing of the stress transistor and the uncontrolled stress transistor; and a power switch transistor turning on/off the biasing. The present invention can extend the life of an integrated circuit, thereby reducing maintenance costs for a circuit or a device.
机译:本发明涉及一种用于测量由总电离剂量效应引起的完全删除模式的绝缘体上硅工艺的集成电路的性能劣化的装置和方法。用于测量由总电离剂量效应引起的电路性能劣化的设备包括:第一逆变器;以及第二逆变器。第N个逆变器直接连接到第一逆变器或通过至少一个不同的逆变器间接连接到第一逆变器;开关选择性地将第一逆变器连接到外部逆变器和第N逆变器中的任何一个。所述第一反相器可以包括:受控应力晶体管;以及不受控制的应力晶体管串联连接至受控制的应力晶体管;传输门晶体管选择性地将不受控制的应力晶体管连接到IN节点;应力模式偏置晶体管,对所述应力晶体管和所述非受控应力晶体管进行偏置;功率开关晶体管导通/截止偏置。本发明可以延长集成电路的寿命,从而减少电路或设备的维护成本。

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