Leveling agent for nickel electrolytic plating and nickel electrolytic plating solution containing the leveling agent

摘要

An embodiment of the present invention, when forming a nickel plated film by the electroplating method on a substrate having a curved surface, it is possible to improve the flatness of the nickel plated film to form a nickel plated film having a uniform thickness nickel plating agent for In addition, an electrolytic solution containing nickel ions and an organic additive including a nickel electroplating flattening agent, a brightening agent and a stress releasing agent are used to form a nickel plated film having a uniform thickness by electroplating on a substrate having complex surface bending. Provided is a technique for forming a nickel plating solution.