Electrolyte composition for tin plating using ionic liquid prepared by mixing choline chloride and thiourea and plating method using the same

摘要

The present invention relates to an electrolyte composition for tin plating using an ionic liquid mixed with choline chloride and thiourea, and a tin plating method using the same. More specifically, the ionic liquid is mixed at an optimum ratio, and malonic acid and oxalic acid. Alternatively, ethylene glycol is added, and additives such as dimethylthiourea as a complexing agent derivative, titanium chloride or sodium phosphate as a reducing agent, and water, and water have low viscosity and high ionic conductivity, enabling fast and stable precipitation of metals. The present invention relates to a composition of an ionic liquid electrolyte which can be used as a reduced electroless tin plating solution capable of growing a film quickly and thickly, and a method of manufacturing the same.