GOLD-STRIKE PLATING METHOD CORRESPONDING TO PRETREATMENT PROCESS FOR ELECTROLESS PALLADIUM PLATING ON COPPER SURFACE OF PRINTED CIRCUIT BOARD COMPOSITION OF GOLD-STRIKE PLATING SOLUTION AND ELECTROLESS PLATING METHOD OF PALLADIUM AND GOLD

摘要

The present invention provides a gold-strike plating solution used to form a gold-strike / palladium / gold plating layer on copper or a copper alloy surface, which comprises: (A) a water-soluble gold compound; (B) a purine compound or a pyrimidine compound having carbonyl oxygen as a local erosion blocker; (C) a complexing agent; (D) a dicarboxylic acid as a conductivity enhancer; (E) (E-1) nitrogen-containing heteroarylcarboxylic acid as a base metal elution inhibition and reprecipitation inhibitor, wherein nitrogen in the component (E-1) is located in a heteroaryl ring and all represents aromatic nitrogen and (E-2) alpha-hydroxycarboxylic acid; (F) a cyanide compound or a sulfite compound as a gold ion stabilizer; and (G) a surface corrosion inhibitor.