COMPOUND FOR ENHANCING ADHESION PROPERTIES OF POLYIMIDE RESIN AND POLYIMIDE COPOLYMER PRODUCED USING SAME

摘要

The present invention provides a novel polyimide resin adhesion enhancer having a fluorene framework, wherein a polyimide film produced using same exhibits conventional properties such as heat resistance and mechanical properties, and maintains adhesion with a carrier substrate while not being affected with respect to retardation even during a high-temperature process.