Plating solution evaluation method and plating solution evaluation mechanism

摘要

PROBLEM TO BE SOLVED: To provide an evaluation method of a plating solution and an evaluation mechanism of a plating solution which can predict the state of a plating solution and a coating film while performing a plating treatment on an object to be plated while having a simple structure. An evaluation mechanism 1 for a copper sulfate plating solution, which is an example of an evaluation mechanism for a copper sulfate plating solution to which the present invention is applied, includes a plating tank 2, a light source 3, a light chopper 4, a lens 5, and light detection. It is provided with a mechanism 6. [Selection diagram] FIG. 9