Joining methods, programs, computer storage media, joining devices and joining systems

摘要

PROBLEM TO BE SOLVED: To appropriately join a plurality of chips arranged on a substrate to the substrate.SOLUTION: A joining method, in a state in which a wafer has a first temperature T1 inside an airtight treatment chamber, compresses the inside of the treatment chamber to a second pressure P2 higher than an atmospheric pressure (step S3); then, heats the wafer to a second temperature T2 higher than the first temperature T1 (step S4); then, joins a plurality of chips to the wafer while keeping the inside of the treatment chamber at the second pressure P2 and keeping the wafer at the second temperature T2 (step S5); then, cools the wafer to a third temperature T3 lower than the second temperature T2 (step S6); and, then, decompresses the inside of the treatment chamber to the atmospheric pressure (step S7).SELECTED DRAWING: Figure 9