首页> 外国专利> Photomask substrate, photomask blank, photomask, method for manufacturing photomask substrate, method for manufacturing photomask, and method for manufacturing display device

Photomask substrate, photomask blank, photomask, method for manufacturing photomask substrate, method for manufacturing photomask, and method for manufacturing display device

机译:光掩模基板,光掩模坯料,光掩模,光掩模基板的制造方法,光掩模的制造方法以及显示装置的制造方法

摘要

The invention provides a photomask, photomask substrate, a method for manufacturing a photomask, a method for manufacturing a photomask substrate, a photomask blank, and a method for manufacturing a display device. To provide a photomask substrate capable of minimizing the possibility of generating foreign matters in a cleaning process and suppressing the risk of occurrence of defects in a photomask blank or photomask manufacturing process. A photomask substrate made of a transparent material for forming a transfer pattern to form a photomask, the photomask substrate comprising: a first main surface for forming a transfer pattern; a second main surface , And has an end face perpendicular to these main surfaces. An inclined region is provided in the vicinity of an end of the first main surface, and the inclined region has a first chamfered surface and a first curved surface provided between the first main surface and the first chamfered surface. The first chamfered surface has an inclination angle with respect to the first main surface of 50 degrees or less and has a flat surface. The curvature radius r 1 (mm) of the first curved surface satisfies 0.3 r 1, and the surface roughness Ra of the first curved surface and the first chamfered surface is less than 0.05 mu m.
机译:本发明提供一种光掩模,光掩模基板,光掩模的制造方法,光掩模基板的制造方法,光掩模坯料以及显示装置的制造方法。提供一种光掩模基板,该光掩模基板能够使在清洁过程中产生异物的可能性最小化,并且抑制在光掩模坯料或光掩模制造过程中出现缺陷的风险。由透明材料制成的光掩模基板,用于形成转印图案以形成光掩模,该光掩模基板包括:第一主表面,用于形成转印图案;以及第二主表面。第二主表面,并且具有垂直于这些主表面的端面。倾斜区域设置在第一主表面的端部附近,并且该倾斜区域具有第一斜切表面和设置在第一主表面和第一斜切表面之间的第一弯曲表面。第一斜切表面相对于第一主表面的倾斜角为50度或更小,并且具有平坦表面。第一曲面的曲率半径r 1(mm)满足0.3 <r 1,第一曲面和第一斜切面的表面粗糙度Ra小于0.05μm。

著录项

  • 公开/公告号JP6632967B2

    专利类型

  • 公开/公告日2020-01-22

    原文格式PDF

  • 申请/专利权人 HOYA株式会社;

    申请/专利号JP20160251712

  • 发明设计人 山口 昇;

    申请日2016-12-26

  • 分类号G03F1/60;C03C15;C03C19;C03C23;

  • 国家 JP

  • 入库时间 2022-08-21 11:33:13

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