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Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices

机译:用于3D结构电子,电磁和机电组件/设备的基于挤出的增材制造系统

摘要

The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.
机译:本发明提供了一种用于通过以下方式制造三维电子,电磁或机电部件/设备的系统和方法:(1)通过逐层沉积基板材料来创建三维基板的一层或多层。方式,其中所述基板包括多个互连腔和部件腔; (2)用导电材料填充互连腔; (3)将一个或多个组件放置在组件腔中。

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