首页> 外国专利> Fiber encapsulation mechanism for energy dissipation in a fiber amplifying system

Fiber encapsulation mechanism for energy dissipation in a fiber amplifying system

机译:用于光纤放大系统中能量消散的光纤封装机制

摘要

The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition, the optical fiber amplifier includes a pump source. Optical pumping by the pump source amplifies optical signals in the optical fiber and generates excess heat and excess photons. The optical fiber amplifier additionally includes a heatsink layer disposed adjacent to the polymer layer. The heatsink layer conducts the excess heat away from the optical fiber. Further, the optical fiber amplifier includes an optically transparent layer disposed adjacent to the polymer layer. The optically transparent layer transmits the excess photons away from the optical fiber.
机译:本发明涉及一种用于光纤放大系统中的能量耗散的光纤封装机构。一个示例实施例包括一种光纤放大器。光纤放大器包括:光纤,其包括增益介质;以及聚合物层,其至少部分地围绕光纤。聚合物层是光学透明的。另外,光纤放大器包括泵浦源。泵浦源进行的光泵浦会放大光纤中的光信号,并产生过多的热量和过多的光子。光纤放大器还包括与聚合物层相邻设置的散热层。散热层将多余的热量从光纤传导出去。此外,光纤放大器包括与聚合物层相邻设置的光学透明层。光学透明层将多余的光子传输离开光纤。

著录项

  • 公开/公告号US10693272B2

    专利类型

  • 公开/公告日2020-06-23

    原文格式PDF

  • 申请/专利权人 WAYMO LLC;

    申请/专利号US201715691917

  • 申请日2017-08-31

  • 分类号H01S3/04;G01S7/481;H01S3/067;G01S17/02;G02B6/02;G02B6/255;H01S3/094;H01S3/16;H01S3/042;H01S3/08;G01S17/10;H01S3/0941;H01S3;

  • 国家 US

  • 入库时间 2022-08-21 11:31:03

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号