首页> 外国专利> Method Of Forming An Array Of Elevationally-Extending Strings Of Programmable Memory Cells And Method Of Forming An Array Of Elevationally-Extending Strings Of Memory Cells

Method Of Forming An Array Of Elevationally-Extending Strings Of Programmable Memory Cells And Method Of Forming An Array Of Elevationally-Extending Strings Of Memory Cells

机译:形成可编程存储器单元的高伸缩字符串的阵列的方法和形成存储器单元的高伸缩字符串的阵列的方法

摘要

A method of forming an array of elevationally-extending strings of memory cells comprises forming and removing a portion of lower-stack memory cell material that is laterally across individual bases in individual lower channel openings. Covering material is formed in a lowest portion of the individual lower channel openings to cover the individual bases of the individual lower channel openings. Upper channel openings are formed into an upper stack to the lower channel openings to form interconnected channel openings individually comprising one of the individual lower channel openings and individual of the upper channel openings. A portion of upper-stack memory cell material that is laterally across individual bases in individual upper channel openings is formed and removed. After the removing of the portion of the upper-stack memory cell material, the covering material is removed from the interconnected channel openings. After the removing of the covering material, transistor channel material is formed in an upper portion of the interconnected channel openings. After forming the transistor channel material, upper-stack and lower-stack sacrificial material is replaced with control-gate material having terminal ends corresponding to control-gate regions of individual memory cells. Charge-storage material is formed between the transistor channel material and the control-gate regions. Insulative charge-passage material is formed between the transistor channel material and the charge-storage material. A charge-blocking region is between the charge-storage material and individual of the control-gate regions.
机译:一种形成存储器单元的高度延伸的串的阵列的方法,包括形成和去除一部分下部堆叠的存储器单元材料,该部分下部堆叠的存储器单元材料横向地跨过各个下部通道开口中的各个基底。在各个下部通道开口的最低部分中形成覆盖材料,以覆盖各个下部通道开口的各个底部。上部通道开口形成为与下部通道开口的上部堆叠,以形成互连的通道开口,该互连的通道开口单独地包括各个下部通道开口之一和各个上部通道开口。形成并去除横向堆叠在各个上部通道开口中的各个基底的一部分上部堆叠存储单元材料。在去除上部堆叠存储单元材料的一部分之后,从互连的通道开口去除覆盖材料。在去除覆盖材料之后,在互连的沟道开口的上部中形成晶体管沟道材料。在形成晶体管沟道材料之后,用具有对应于各个存储单元的控制栅区域的末端的控制栅材料来代替上堆叠和下堆叠牺牲材料。在晶体管沟道材料和控制栅区域之间形成电荷存储材料。在晶体管沟道材料和电荷存储材料之间形成绝缘性电荷通过材料。电荷阻挡区域在电荷存储材料与各个控制栅区域之间。

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