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INFRARED DETECTOR, INFRARED DETECTION DEVICE, AND METHOD OF MANUFACTURING INFRARED DETECTOR

机译:红外探测器,红外检测装置以及制造红外探测器的方法

摘要

An infrared detector includes a pixel separation wall. The infrared detector includes a semiconductor crystal substrate; a first contact layer formed on the semiconductor crystal substrate, a pixel separation wall formed on the first contact layer and configured to separate pixels; a buffer layer formed on the first contact layer and on a side surface of the pixel separation wall in a region surrounded by the pixel separation wall, an infrared-absorbing layer formed on the buffer layer, a second contact layer formed on the infrared-absorbing layer, an upper electrode formed on the second contact layer, and a lower electrode formed on the first contact layer. The buffer layer and the first contact layer are formed of a compound semiconductor of a first conductivity type. The pixel separation wall and the second contact layer are formed of a compound semiconductor of a second conductivity type.
机译:红外检测器包括像素分隔壁。红外检测器包括半导体晶体基板;和第一接触层形成在半导体晶体基板上,像素分隔壁形成在第一接触层上并被配置为分隔像素;在由像素分隔壁包围的区域中的第一接触层和像素分隔壁的侧表面上形成的缓冲层,在缓冲层上形成的红外吸收层,在红外吸收层上形成的第二接触层层,形成在第二接触层上的上电极和形成在第一接触层上的下电极。缓冲层和第一接触层由第一导电类型的化合物半导体形成。像素分隔壁和第二接触层由第二导电类型的化合物半导体形成。

著录项

  • 公开/公告号US2020013822A1

    专利类型

  • 公开/公告日2020-01-09

    原文格式PDF

  • 申请/专利权人 FUJITSU LIMITED;

    申请/专利号US201916438521

  • 发明设计人 SHIGEKAZU OKUMURA;

    申请日2019-06-12

  • 分类号H01L27/146;H01L31/0352;H01L31/0304;H01L31/18;

  • 国家 US

  • 入库时间 2022-08-21 11:18:40

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