首页> 外国专利> Method of soldering ceramic or difficult-to-wet metal material with higher shear strength and soldered joints ceramic / ceramic, ceramic / metal and metal / metal with titanium-free solder

Method of soldering ceramic or difficult-to-wet metal material with higher shear strength and soldered joints ceramic / ceramic, ceramic / metal and metal / metal with titanium-free solder

机译:焊接具有较高剪切强度的陶瓷或难于润湿的金属材料的方法以及采用无钛焊料的陶瓷/陶瓷,陶瓷/金属和金属/金属的焊接接头

摘要

The method of soldering a ceramic or hard-to-wettable metal material with a higher shear strength of a ceramic / ceramic, ceramic / metal and metal / metal solder with a titanium-free solder is carried out by first forming a laser-structured surface on the soldered smooth surface of the ceramic or hard-to-wettable metal material surface texture with square element elements 1.5 mm to 3.0 mm x 1.5 mm to 3.0 mm with conversion profile with a texture density of 12.5% to 51% and a texture depth of 0.05 to 0.2 mm. Subsequently, a Zn-free titanium-free solder is applied to the metal or ceramic part of the joint without microstructuring at a temperature of 250 ° C to 450 ° C, and an active ultrasound with a frequency of 40 kHz is applied.
机译:通过首先形成激光结构化的表面来实施将陶瓷/陶瓷,陶瓷/金属和金属/金属焊料的具有较高剪切强度的陶瓷或难润湿金属材料与无钛焊料焊接的方法。在具有1.5 mm至3.0 mm x 1.5 mm至3.0 mm方形元素的陶瓷或难湿金属材料表面的焊接光滑表面上,具有12.5%至51%的纹理密度和纹理深度的转换轮廓0.05至0.2毫米随后,在250°C至450°C的温度下,在无微结构的情况下,将无Zn的无钛焊料应用于接头的金属或陶瓷部分,并施加40 kHz的有源超声。

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