首页>
外国专利>
THERMALLY CONDUCTIVE RESIN SHEET, LAYERED THERMAL RADIATION SHEET, HEAT-DISSIPATING CIRCUIT BASE BOARD, AND POWER SEMICONDUCTOR DEVICE
THERMALLY CONDUCTIVE RESIN SHEET, LAYERED THERMAL RADIATION SHEET, HEAT-DISSIPATING CIRCUIT BASE BOARD, AND POWER SEMICONDUCTOR DEVICE
展开▼
机译:导热树脂板,层状热辐射板,散热电路基板和功率半导体装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
Provided is a thermally conductive resin sheet having sufficient withstand voltage performance and excellent moisture absorption reflow tolerance that comprises a resin composition containing a crystalline thermoplastic resin having a fusing point of 300°C or higher and a thermally conductive filler, the thermally conductive filler containing aggregated boron nitride particles. In addition, the thermally conductive resin sheet according to another mode of the present invention comprises a resin composition containing between 15% by mass and 40% by mass inclusive of the crystalline thermoplastic resin having a fusing point of 300°C or higher, and between 60% by mass and 85% by mass inclusive of the thermally conductive filler, the thermal conductivity in the thickness direction being 5.0 W/m·K or higher at 25°C.
展开▼