首页> 外国专利> GAN- PVD ALN OXYGEN CONTROLLED PVD ALN BUFFER FOR GAN-BASED OPTOELECTRONIC AND ELECTRONIC DEVICES

GAN- PVD ALN OXYGEN CONTROLLED PVD ALN BUFFER FOR GAN-BASED OPTOELECTRONIC AND ELECTRONIC DEVICES

机译:用于GAN基光电器件的GAN- PVD ​​ALN氧气控制的PVD ALN缓冲装置

摘要

An oxygen controlled PVD AlN buffer for GaN-based optoelectronic and electronic devices is disclosed. Also disclosed is a method of forming a PVD AlN buffer for GaN-based optoelectronic and electronic devices in an oxygen-controlled manner. By way of example, a method of forming an aluminum nitride (AlN) buffer layer for GaN-based optoelectronic or electronic devices includes reactive sputtering an AlN layer on a substrate, where the reactive sputtering is a nitrogen-containing gas or a nitrogen-containing gas. Reacting the plasma with the aluminum-containing target contained in the physical vapor deposition (PVD) chamber. This method further includes introducing oxygen into the AlN layer.
机译:公开了一种用于基于GaN的光电和电子器件的氧控制PVD AlN缓冲器。还公开了一种以氧控制的方式形成用于基于GaN的光电和电子器件的PVD AlN缓冲器的方法。举例来说,形成用于基于GaN的光电或电子器件的氮化铝(AlN)缓冲层的方法包括在基板上反应溅射AlN层,其中反应溅射是含氮气体或含氮气体。加油站。使等离子体与包含在物理气相沉积(PVD)室中的含铝靶反应。该方法还包括将氧引入AlN层中。

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