Electrochemical migration preventive additives and method for inhibiting electrochemical migration by using the same

摘要

The present invention relates to an electrochemical migration (ECM) prevention additive of a wiring. The present invention relates to a method for preventing ECM of the wiring using the prevention additive. When a solution, to which the ECM prevention additive proposed in the present invention is added, is compared with an existing solution, generation of dendrite is suppressed to confirm an ECM time to be longer. The additive proposed in the present invention is mixed or used to a polymer material such as epoxy molding compound (EMC), underfill or the like, or is added to a metal wiring to increase reliability of a semiconductor element.