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Vacuum picker and apparatus for transferring semiconductor packages having the same

机译:真空拾取器和用于传送具有该真空拾取器的半导体封装的设备

摘要

Disclosed is a semiconductor package transfer apparatus having vacuum pickers for transferring semiconductor packages. The vacuum pickers may include a nozzle having a vacuum nozzle having a vacuum hole for vacuum suction of a semiconductor package and an inner space connected to the vacuum nozzle, and a vacuum flow path coupled to the nozzle body and connected to an inner space of the nozzle body. And a picker body having a movably disposed in a vertical direction through the vacuum nozzle, and moved into the vacuum nozzle when vacuum absorbing the semiconductor package, and downward from the vacuum nozzle when the semiconductor package is placed in a predetermined place. And a first pin member protruding to push the semiconductor package, and a first guide member disposed in the vacuum hole to guide the vertical movement of the pin.
机译:公开了一种具有用于拾取半导体封装的真空拾取器的半导体封装传送设备。真空拾取器可以包括:喷嘴,其具有:真空喷嘴,其具有用于真空抽吸半导体封装的真空孔;以及与真空喷嘴连接的内部空间;以及真空流路,其耦合至喷嘴主体并连接至真空容器的内部空间。喷嘴体。一拾取器主体,其具有沿垂直方向可移动地设置通过真空喷嘴的位置,并且当真空吸收半导体封装时移动到真空喷嘴中,并且当将半导体封装放置在预定位置时从真空喷嘴向下移动。第一销构件突出以推动半导体封装,第一引导构件布置在真空孔中以引导销的垂直运动。

著录项

  • 公开/公告号KR102080871B1

    专利类型

  • 公开/公告日2020-02-24

    原文格式PDF

  • 申请/专利权人 세메스 주식회사;

    申请/专利号KR20180079503

  • 发明设计人 이희철;신금수;김학만;

    申请日2018-07-09

  • 分类号H01L21/677;

  • 国家 KR

  • 入库时间 2022-08-21 11:05:16

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