POLYMER MONOLAYER FILM CONTAINING CONDUCTIVE PARTICLES, MANUFACTURING METHOD OF POLYMER MONOLAYER FILM, AND METHOD FOR CONNECTING SOCKET INTERPOSER FOR SEMICONDUCTOR PACKAGE TEST USING POLYMER MONOLAYER FILM

摘要

Disclosed are a polymer monolayer film containing conductive particles, a manufacturing method of the polymer monolayer film, and a method for connecting a socket interposer for a semiconductor package test using the polymer monolayer film. According to one embodiment, the method for connecting a socket interposer does not form an electrical short circuit by using an anisotropic conductive film (ACF) of several layers or less making metal particles to be present in a single layer to replace the existing interposer while having stable electrical characteristics.;COPYRIGHT KIPO 2020