首页> 外国专利> Arrangement of a substrate made of a piezoelectric material and a carrier substrate and method for their production

Arrangement of a substrate made of a piezoelectric material and a carrier substrate and method for their production

机译:由压电材料制成的基板和载体基板的布置及其制造方法

摘要

(Object) The object is to improve the joining strength of a joined body when joining a substrate made of a piezoelectric material composed of lithium tantalate or the like and a support substrate with a silicon oxide layer provided thereon. (Solution) A joined body includes a support substrate 4 , a silicon oxide layer 5 provided on the support substrate 4, and a substrate made of a piezoelectric material 1 provided on the silicon oxide layer 5 and composed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate is. The surface resistivity of the substrate made of a piezoelectric material 1 on the silicon oxide layer 5 side is 1.7 × 10 15 Ω / □ or higher.
机译:(目的)目的是在将由钽酸锂等构成的压电材料制的基板和支撑基板上具有氧化硅层接合时,提高接合体的接合强度。 (解决方案)接合体包括:支撑基板4;设置在支撑基板4上的氧化硅层5;以及由压电材料1制成的基板,该压电材料1设置在氧化硅层5上并且由选自以下的材料构成:是铌酸锂,钽酸锂和铌酸锂-钽酸锂。由压电材料1制成的基板在氧化硅层5侧的表面电阻率为1.7×10 15Ω/□或更高。

著录项

  • 公开/公告号DE112018006912T5

    专利类型

  • 公开/公告日2020-10-01

    原文格式PDF

  • 申请/专利权人 NGK INSULATORS LTD.;

    申请/专利号DE20181106912T

  • 申请日2018-11-19

  • 分类号H03H9/25;H03H3/08;

  • 国家 DE

  • 入库时间 2022-08-21 11:01:33

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