The invention relates to the proposal for an electrode arrangement in a device for carrying out processes of physical vapor deposition, which greatly reduces or even prevents the degradation of the electrode material due to deposits. The soiling of the anode by cathodic carbon that occurs in these processes is minimized or prevented by the fact that an adhesion-reducing thin layer with high electrical conductivity is applied to the anode, which has poorer adhesion properties with regard to the coating material than the uncoated anode material. This layer is preferably a nitride layer, particularly preferably made of TiN, applied with a layer thickness between 0.1 μm and 3.5 μm.
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