首页> 外国专利> A method of reducing the surface roughness of a joint surface of a sintered paste layer and pressure sintering method therewith and a sintered joint making device for performing it

A method of reducing the surface roughness of a joint surface of a sintered paste layer and pressure sintering method therewith and a sintered joint making device for performing it

机译:降低烧结糊剂层的接合面的表面粗糙度的方法及其压力烧结方法以及进行该烧结烧结体的接合装置

摘要

The invention relates to a method for reducing the surface roughness of a connection surface of a sintered paste layer, wherein the connection surface is arranged facing away from a first connection partner on which the sintered paste layer is arranged, with the following successive method steps: a) arranging the sintered paste layer on the first connection partner, b) applying vibrations to the Sintered paste layer by means of a vibration application device which is designed to generate mechanical vibrations. The invention also relates to a related sintered connection production device.
机译:本发明涉及一种用于减小烧结糊剂层的连接表面的表面粗糙度的方法,其中,所述连接表面背向布置有烧结糊剂层的第一连接配对件,并具有以下连续的方法步骤: a)将烧结的糊剂层布置在第一连接配对件上,b)借助于设计成产生机械振动的振动施加装置将振动施加到烧结的糊剂层上。本发明还涉及一种相关的烧结连接生产装置。

著录项

  • 公开/公告号DE102020103288B3

    专利类型

  • 公开/公告日2020-10-29

    原文格式PDF

  • 申请/专利权人 SEMIKRON ELEKTRONIK GMBH & CO. KG;

    申请/专利号DE202010103288

  • 发明设计人 NICO BECKER;

    申请日2020-02-10

  • 分类号H01L21/58;H01L21/60;

  • 国家 DE

  • 入库时间 2022-08-21 11:01:06

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