首页>
外国专利>
Heat dissipation structure of an electronic device
Heat dissipation structure of an electronic device
展开▼
机译:电子设备的散热结构
展开▼
页面导航
摘要
著录项
相似文献
摘要
Heat dissipation structure of an electronic device, comprising:a metal housing; anda rigid-flexible PCB located in the metal housing and comprising a rigid part and a flexible part connected to the rigid part,where at least part of the flexible part is in contact with the metal housing in order to allow heat generated by an electronic component fitted to the rigid part to be delivered to the metal housing.
展开▼