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COMPOSITIONS ET PROCÉDÉS DE POLISSAGE CHIMICO-MÉCANIQUE (CMP) DE PASSIVATION DE MÉTAL
COMPOSITIONS ET PROCÉDÉS DE POLISSAGE CHIMICO-MÉCANIQUE (CMP) DE PASSIVATION DE MÉTAL
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摘要
The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.
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