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Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

机译:增材制造与喷墨印刷电子产品的整合:具有嵌入式多功能性的零件的潜在途径

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摘要

Additive manufacturing, an umbrella term for a number of different manufacturing techniques, has attracted increasing interest recently for a number of reasons, such as the facile customisation of parts, reduced time to manufacture from initial design, and possibilities in distributed manufacturing and structural electronics. Inkjet printing is an additive manufacturing technique that is readily integrated with other manufacturing processes, eminently scalable and used extensively in printed electronics. It therefore presents itself as a good candidate for integration with other additive manufacturing techniques to enable the creation of parts with embedded electronics in a timely and cost effective manner. This review introduces some of the fundamental principles of inkjet printing; such as droplet generation, deposition, phase change and post-deposition processing. Particular focus is given to materials most relevant to incorporating structural electronics and how post-processing of these materials has been able to maintain compatibility with temperature sensitive substrates. Specific obstacles likely to be encountered in such an integration and potential strategies to address them will also be discussed.
机译:增材制造是许多不同制造技术的总称,近来由于多种原因引起了越来越多的兴趣,例如零件的简便定制,从初始设计开始的制造时间减少以及分布式制造和结构电子学的可能性。喷墨印刷是一种增材制造技术,可以很容易地与其他制造工艺集成在一起,具有极高的可扩展性,并广泛用于印刷电子领域。因此,它本身就是与其他增材制造技术集成的良好候选者,从而可以及时且经济高效地创建带有嵌入式电子产品的零件。这篇评论介绍了喷墨打印的一些基本原理;例如液滴的产生,沉积,相变和沉积后处理。特别关注与整合结构电子学最相关的材料,以及这些材料的后处理如何能够保持与温度敏感基材的兼容性。还将讨论在这种整合中可能遇到的具体障碍以及解决这些障碍的潜在策略。

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