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SCREAM I: A single mask, singlecrystal silicon process for microelectromechanical structures

机译：sCREam I：用于微机电结构的单掩模，单晶硅工艺

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Kevin A. Shaw; Z. Lisa Zhang; Noel C. Macdonald;
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年度 1993
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1. Evaluation of a Single-Crystal-Silicon Microelectromechanical Systems Resonator Utilizing a Narrow Gap Process [J] . Keita Hashimoto, Kouzaburo Ito, Hiroshi Tanigawa, Japanese journal of applied physics . 2011,第6Issue1期

机译：利用窄间隙工艺评估单晶硅微机电系统谐振器
2. Fabrication of high aspect ratio silicon micro-structures based on aluminum mask patterned by IBE and RIE processing [J] . Mu Jiliang, Chou Xiujian, He Ting, Microsystem technologies . 2016,第1期

机译：基于IBE和RIE工艺图案化的铝掩模的高深宽比硅微结构的制备
3. Passive alignment of single-mode fibers to integrated polymer waveguide structures utilizing a single-mask process [J] . Moosburger R., Hauffe R. IEEE Photonics Technology Letters . 1999,第7期

机译：利用单掩模工艺将单模光纤与集成的聚合物波导结构进行被动对准
4. SCREAM I: A single mask, single-crystal silicon process for microelectromechanical structures [C] . Shaw, K.A., Zhang, . 1993

机译：SCREAM I：用于微机电结构的单掩模，单晶硅工艺
5. Laser processing, properties, and theoretical modeling of cobalt disilicide/silicon, titanium nitride/silicon, silicon/titanium nitride/silicon, and copper/titanium nitride/silicon heterostructures. [D] . Chowdhury, Rina. 1995

机译：二硅化钴/硅，氮化钛/硅，硅/氮化钛/硅和铜/氮化钛/硅异质结构的激光加工，性能和理论模型。
6. Low-damage direct patterning of silicon oxide mask by mechanical processing [O] . Shojiro Miyake, Shohei Yamazaki 2014

机译：通过机械加工对氧化硅掩模进行低损伤的直接构图
7. Optimized lithography process for through-silicon vias-fabrication using a double-sided (structured) photomask for mask aligner lithography [O] . Weichelt, Tina, Stürzebecher, Lorenz, Zeitner, Uwe D. 2015

机译：采用双面（结构化）光掩模制作硅通孔制造的优化光刻工艺，用于掩模对准器光刻

SCREAM I: A single mask, singlecrystal silicon process for microelectromechanical structures

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