首页> 外文OA文献 >Material Removal Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern

【2h】

Material Removal Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern

机译：用仿生模式仿生抛光垫进行化学机械抛光的材料去除分布

页面导航

著录项
相似文献
相关主题

著录项

作者
Yushan Lu; Jun Wang; Nan Li; Tian Zhang; Min Duan E;
展开▼
作者单位

展开▼
年度 2016
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Material removal distribution of chemical mechanical polishing by the bionic polishing pad with phyllotactic pattern [J] . Lu Y., Wang J., Li N., Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2011,第Null期

机译：具有叶序型仿生抛光垫的化学机械抛光材料去除分布
2. Experimental investigation of polishing temperature by bionic polishing pad with phyllotactic pattern [J] . Xiaolong Sheng, Hua Long, Yongxin Luo, Energy education science and technology . 2013,第3期

机译：具有叶序图案的仿生抛光垫抛光温度的实验研究
3. A study of material removal amount of sapphire wafer in application of chemical mechanical polishing with different polishing pads [J] . Zone-Ching Lin, Wei-Shuen Huang, Ju-Shiau Tsai Journal of Mechanical Science and Technology . 2012,第8期

机译：不同抛光垫化学机械抛光中蓝宝石晶片材料去除量的研究
4. Material Removal Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern [C] . Yushan Lu, Jun Wang, Nan Li, Conference on Application of Diamond and Related Materials in China . 2011

机译：仿生抛光垫用植物图案的材料去除分布化学机械抛光
5. Development of a new generation polyurethane polishing pad used in chemical mechanical planarization of microelectronic materials. [D] . Shah, Viraj K. 2002

机译：开发用于微电子材料化学机械平面化的新一代聚氨酯抛光垫。
6. Investigation on the Material Removal and Surface Generation of a Single Crystal SiC Wafer by Ultrasonic Chemical Mechanical Polishing Combined with Ultrasonic Lapping [O] . Yong Hu, Dong Shi, Ye Hu, 2018

机译：超声化学机械抛光与超声研磨相结合的单晶碳化硅晶片材料去除及表面生成研究
7. The Effect of Pad-asperity Curvature on Material Removal Rate in Chemical-mechanical Polishing [O] . Kim Sanha, Saka Nannaji, Chun Jung-Hoon 2014

机译：化学机械抛光中抛光垫曲率对材料去除率的影响

Material Removal Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern

著录项

相似文献

相关主题

期刊订阅