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TC: Large: Collaborative Research: 3Dsec: Trustworthy System Security through 3-D Integrated Hardware proposal

机译：TC：大型：协作研究：3Dsec：通过3-D集成硬件的可信赖的系统安全性提案

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Grant Proposal, Proposal No. 0910734, Solicitation No. 08-578, Trustworthy Computing (TC) Program, Division of Computer and Network Systems (CNS), National Science Foundation (NSF), 25 November 2008. [Proposal]

机译：美国国家科学基金会（NSF）的可信赖计算（TC）计划，美国国家科学基金会（NSF）的可信赖计算（TC）计划，提案提案编号：0910734，提案编号：08-578，[提案]

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Huffmire Ted; Irvine Cynthia (Co-PI); Sherwood Timothy (PI); Kastner Ryan (PI);
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1. Integrated Secure Hardware and Operating System for Leading System Security Solutions [J] . Wireless design and development . 2010,第2期

机译：领先的系统安全解决方案的集成安全硬件和操作系统
2. Component-based hardware/software co-verification for building trustworthy embedded systems [J] . Fei Xie, Guowu Yang, Xiaoyu Song The Journal of Systems and Software . 2007,第5期

机译：基于组件的硬件/软件协同验证，用于构建可信赖的嵌入式系统
3. Basis for an integrated security ontology according to a systematic review of existing proposals [J] . Carlos Blanco, Joaquin Lasheras, Eduardo Fernandez-Medina, Computer standards & interfaces . 2011,第4期

机译：根据对现有建议的系统审查得出的集成安全本体的基础
4. Extended Abstract: Trustworthy System Security through 3-D Integrated Hardware [C] . Ted Huffmire, Jonathan Valamehr, Timothy Sherwood, IEEE International Worksohp on Hardware-Oriented Security and Trust . 2008

机译：扩展摘要：通过3-D集成硬件值得信赖的系统安全性
5. Integrated hardware/software approaches to software security for embedded systems. [D] . Gelbart, Olga. 2008

机译：用于嵌入式系统软件安全性的集成硬件/软件方法。
6. A Pixel Pitch-Matched Ultrasound Receiver for 3-D Photoacoustic Imaging With Integrated Delta-Sigma Beamformer in 28-nm UTBB FD-SOI [O] . Man-Chia Chen, Aldo Peña Perez, Sri-Rajasekhar Kothapalli, -1

机译：像素间距匹配的超声接收器用于在28nm UTBB FD-SOI中集成Delta-Sigma波束形成器的3D光声成像
7. 3D Security, 3Dsec: Trustworthy System Security through 3D Integrated Hardware poster [O] . Huffmire Ted, Kastner Ryan, Sherwood Tim, 2012

机译：3D安全性，3Dsec：通过3D集成硬件的可信赖的系统安全性海报

TC: Large: Collaborative Research: 3Dsec: Trustworthy System Security through 3-D Integrated Hardware proposal

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