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Efficacy of single and double SiNx interlayers on defect reduction in GaN overlayers grown by organometallic vapor-phase epitaxy

机译:单和双SiNx中间层对通过有机金属气相外延生长的GaN覆盖层中的缺陷减少的功效

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摘要

We report on the growth of and evolution of defects in GaN epilayers having single- and double-layer SiNx nanoporous insertion layers. The SiNx was formed in situ in the growth chamber of an organometallic vapor-phase epitaxy system by simultaneous flow of diluted silane and ammonia. The GaN epilayers and SiNx interlayers were grown on 6H-SiC substrates using three different nucleation layers, namely, low-temperature GaN, high-temperature GaN, and high-temperature AlN nucleation layers. X-ray-diffraction rocking curves and cross-sectional and plan-view transmission electron microscope analyses indicated that a nanoporous SiNx layer can reduce the dislocations density in the GaN overgrown layer to ∼3×108cm−2 range; below this level the defect blocking effect of SiNx would saturate. Therefore the insertion of a second SiNx layer becomes much less effective in reducing dislocations, although it continues to reduce the point defects, as suggested by time-resolved photoluminescence measurements. The insertion of SiNx interlayers was found to improve significantly the mechanical strength of the GaN epilayers resulting in a much lower crack line density.
机译:我们报道了具有单层和双层SiNx纳米多孔插入层的GaN外延层中缺陷的生长和演变。通过同时稀释的硅烷和氨流,在有机金属气相外延系统的生长室内原位形成SiNx。使用3种不同的成核层,即低温GaN,高温GaN和高温AlN成核层,在6H-SiC衬底上生长GaN外延层和SiNx中间层。 X射线衍射摇摆曲线以及横截面和平面图的透射电子显微镜分析表明,纳米多孔SiNx层可以将GaN过度生长层中的位错密度降低到约3×108cm-2范围;低于此水平,SiNx的缺陷阻挡作用将饱和。因此,如时间分辨的光致发光测量所建议的,尽管第二SiNx层的插入继续减少了点缺陷,但其在减少位错方面变得无效得多。发现插入SiNx中间层可以显着提高GaN外延层的机械强度,从而大大降低裂纹线密度。

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