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Electrodeposition of Co-Mo-P barrier coatings for Cu/Au coated systems

机译:用于Cu / Au涂层系统的Co-Mo-P阻挡涂层的电沉积

摘要

By using citrate as the complexing agent, cobalt-molybdenum-phosphorus (Co-Mo-P) alloy coatings were successfully developed and electrodeposited. Coatings containing up to about 10% Mo have been produced. Coating containing 8% Mo, 20% phosphorus and Co balance have been investigated further as barrier coating. To study the diffusion property, the apparent interdiffusion coefficients of Cu/CoMo-P/Ni were determinated. The micro-profiling and Boltzmann-Matano Method were used to obtain the interdiffusion coefficients. It was found that the interdiffusion coefficients for nickel are higher than that the apparent interdiffusion coefficients of the Cu/Co-Mo-P alloys. The results have indicated the potentials of Co-MoP alloy as effective substitutes for nickel.
机译:通过使用柠檬酸盐作为络合剂,成功开发并电沉积了钴-钼-磷(Co-Mo-P)合金涂层。已经生产出包含高达约10%Mo的涂层。含8%Mo,20%磷和Co平衡的涂层已作为阻隔涂层进行了进一步研究。为了研究扩散性能,确定了Cu / CoMo-P / Ni的表观互扩散系数。微轮廓分析和玻尔兹曼-马塔诺方法用于获得互扩散系数。已经发现,镍的互扩散系数高于Cu / Co-Mo-P合金的表观互扩散系数。结果表明了Co-MoP合金作为镍的有效替代品的潜力。

著录项

  • 作者

    Siu CL; Man HC; Yeung CH;

  • 作者单位
  • 年度 2005
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  • 原文格式 PDF
  • 正文语种 eng
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