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N-channel Fluorinated Copper Phthalocyanine Thin-Film Transistors Utilizing Oxygen-Plasma-Treatment ITO Source and Drain Electrodes

机译:利用氧等离子体处理ITO源极和漏极的N沟道氟化铜酞菁薄膜晶体管

摘要

[[abstract]]In this study, device characterization and carrier transport properties of n-type fluorinated copper phthalocyanine (F16CuPc) organic thin-film transistors (OTFTs) were investigated using bottom gate device configuration with oxygen-plasma-treatment indium-tin-oxide (ITO) bottom source and drain (S/D) contact. We fabricated F16CuPc-based OTFTs having comb-shaped channels with a series of channel lengths of 5∼100 μm at a fixed channel width. The electrical characteristics of OTFTs were measured by a Keithley 4200-SCS semiconductor parameter analyzer in a dark glove box in a nitrogen atmosphere to avoid the influence of measuring environments. The device characteristics were analyzed using the charge-sheet metal-oxide-semiconductor field-effect transistor model equation. We found that both the linear and saturation field-effect mobilities and threshold voltages of F16CuPc-based OTFTs increased with increasing channel length. The linear and saturated field-effect mobilities were gate-bias dependent in all devices with different channel dimensions. Moreover, the contact resistance between ITO S/D electrodes and F16CuPc and channel resistance of F16CuPc were investigated using the gated-transfer length method. The results of our experiments suggest that the contact resistance between ITO electrodes and F16CuPc plays an important role in current-voltage characteristics. Additionally, abnormal increases in saturated field-effect mobility at channel lengths below 10 μm were observed in our experimental devices and were attributed to short channel effects. Such non-ideal effects of the present F16CuPc-based OTFT devices were investigated in detail. In summary, we found that the oxygen-plasma-treatment ITO bottom contact S/D electrode-based F16CuPc OTFT devices were very durable and suitable to make large area transistor arrays with complicated integrated circuits by photolithography techniques.
机译:[[摘要]]在这项研究中,我们采用氧栅等离子体处理的铟锡锡结构,研究了n型氟化铜酞菁(F16CuPc)有机薄膜晶体管(OTFT)的器件特性和载流子传输特性。氧化物(ITO)底部源极和漏极(S / D)触点。我们制造了基于F16CuPc的OTFT,该OTFT具有梳形沟道,在固定的沟道宽度下,一系列沟道长度为5至100μm。为了避免测量环境的影响,通过吉时利4200-SCS半导体参数分析仪在深色手套箱中在氮气氛下测量OTFT的电特性。使用电荷表金属氧化物半导体场效应晶体管模型方程分析了器件特性。我们发现,基于F16CuPc的OTFT的线性和饱和场效应迁移率以及阈值电压都随着沟道长度的增加而增加。在具有不同沟道尺寸的所有器件中,线性和饱和场效应迁移率取决于栅极偏置。此外,使用门控传输长度法研究了ITO S / D电极与F16CuPc之间的接触电阻和F16CuPc的沟道电阻。我们的实验结果表明,ITO电极与F16CuPc之间的接触电阻在电流-电压特性中起着重要作用。此外,在我们的实验装置中,观察到低于10μm的沟道长度时,饱和场效应迁移率的异常增加,这归因于短沟道效应。详细研究了基于F16CuPc的OTFT器件的这种非理想效应。总而言之,我们发现基于氧等离子体处理的ITO底部接触S / D电极的F16CuPc OTFT器件非常耐用,适合通过光刻技术制造具有复杂集成电路的大面积晶体管阵列。

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  • 作者

    Wang Yu-Wu;

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  • 年度 2013
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  • 原文格式 PDF
  • 正文语种 en
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