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A Comparative Study on the Switching Performance of GaN and Si Power Devices for Bipolar Complementary Modulated Converter Legs

机译:双极互补调制转换器腿GaN和Si功率装置的开关性能的比较研究

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摘要

The commercial mature gallium nitride high electron mobility transistors (GaN HEMT) technology has drawn much attention for its great potential in industrial power electronic applications. GaN HEMT is known for low on-state resistance, high withstand voltage, and high switching frequency. This paper presents comparative experimental evaluations of GaN HEMT and conventional Si insulated gate bipolar transistors (Si IGBTs) of similar power rating. The comparative study is carried out on both the element and converter level. Firstly, on the discrete element level, the steady and dynamic characteristics of GaN HEMT are compared with Si-IGBT, including forward and reverse conducting character, and switching time. Then, the elemental switching losses are analyzed based on measured data. Finally, on a complementary buck converter level, the overall efficiency and EMI-related common-mode currents are compared. For the tested conditions, it is found that the GaN HEMT switching loss is much less than for the same power class IGBT. However, it is worth noting that special attention should be paid to reverse conduction losses in the PWM dead time (or dead band) of complementary-modulated converter legs. When migrating from IGBT to GaN, choosing a dead-time and negative gate drive voltage in conventional IGBT manner can make GaN reverse conducting losses high. It is suggested to use 0 V turn-off gate voltage and minimize the GaN dead time in order to make full use of the GaN advantages.
机译:商业成熟氮化镓高电子迁移率晶体管(GaN HEMT)技术对其在工业电力电子应用中的巨大潜力引起了很多关注。 GaN HEMT以低导通电阻,高耐电压和高开关频率而闻名。本文介绍了GaN HEMT和传统SI绝缘栅双极晶体管(SI IGBT)的比较实验评估。对比研究是在元件和转换器水平上进行的。首先,在离散元素水平上,将GaN HEMT的稳态和动态特性与SI-IGBT进行比较,包括前向和反向导电字符和切换时间。然后,基于测量数据分析元素切换损耗。最后,在互补的降压转换器水平上,比较整体效率和EMI相关的共模电流。对于测试的条件,发现GaN HEMT开关损耗远小于相同的功率等级IGBT。然而,值得注意的是,应特别注意互补调制转换器腿的PWM死区时间(或死区)中的反向传导损耗。当从IGBT迁移到GaN时,以常规IGBT方式选择停止时间和负栅极驱动电压,可以使GaN反向导电损耗高。建议使用0 V关闭栅极电压并最大限度地减少GaN死区时间,以充分利用GaN优势。

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