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Development of a 50W Class Direct Diode Laser System for Materials Processing and its Processing Characteristics(Physics, Processes, Instruments Measurements)

机译：用于材料加工的50W级直接二极管激光系统的开发及其加工特性（物理，过程，仪器和测量）

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作者
Abe Nobuyuki; Kunugita Yasushi; Noguchi Shuichi; Miyake Shoji;
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年度 2015
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原文格式 PDF
正文语种 eng
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专利

1. Development of a 50W Class Direct Diode Laser System for Materials Processing and its Processing Characteristics [J] . Nobuyuki ABE, Yasushi KUNUGITA, Shuichi NOGUCHI, Transactions of JWRI . 1998,第2期

机译：用于材料加工的50W级直接二极管激光系统的开发及其加工特性
2. Materials Processing Characteristics of a 2kW Class High Power Density Direct Diode Laser System [J] . Nobuyuki ABE, Ritsuko HIGASHINO, Masahiro TSUKAMOTO Transactions of JWRI . 1999,第2期

机译：2kW级高功率密度直接二极管激光系统的材料加工特性
3. Beam Characteristics of a 10W Class Direct Diode Laser System for Materials Processing [J] . Nobuyuki ABE, Yasushi KUNUGITA Transactions of JWRI . 1997,第2期

机译：用于材料加工的10W级直接二极管激光系统的光束特性
4. Materials Processing Characteristics of a 2kW Class High Power Density Direct Diode Laser System [C] . Nobuyuki ABE, Ritsuko HIGASHINO, Masahiro TSUKAMOTO, Laser materials processing conference . 2000

机译：2KW类高功率密度直接二极管激光系统的材料处理特性
5. Thermo-kinetic modeling and experimental investigations of laser surface modification processes by using high power direct diode laser. [D] . Santhanakrishnan, Soundarapandian. 2010

机译：使用大功率直接二极管激光器的激光表面改性过程的热动力学建模和实验研究。
6. Development of a support system for measurement and analysis of thinking processes based on a metacognitive interpretation framework: a case study of dissolution of belief conflict thinking processes [O] . Yuki Hayashi, Kazuhisa Seta, Mitsuru Ikeda -1

机译：基于元认知解释框架的思维过程的度量和分析支持系统的开发：信仰冲突思维过程解散的案例研究
7. Materials Processing Characteristics of a 2kW Class High Power Density Direct Diode Laser System(Physics, Processes, Instruments Measurements) [O] . Abe Nobuyuki, Higashino Ritsuko, Tsukamoto Masahiro, 2015

机译：2kW级高功率密度直接二极管激光系统的材料加工特性（物理，过程，仪器和测量）

Development of a 50W Class Direct Diode Laser System for Materials Processing and its Processing Characteristics(Physics, Processes, Instruments Measurements)

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