首页> 外文OA文献 >A systematic study of (NH4)(2)S passivation (22, 10, 5, or 1) on the interface properties of the Al2O3/In0.53Ga0.47As/InP system for n-type and p-type In0.53Ga0.47As epitaxial layers
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A systematic study of (NH4)(2)S passivation (22, 10, 5, or 1) on the interface properties of the Al2O3/In0.53Ga0.47As/InP system for n-type and p-type In0.53Ga0.47As epitaxial layers

机译:对(NH4)(2)S钝化(22%,10%,5%或1%)的Al2O3 / In0.53Ga0.47As / InP系统的n型和p型钝化性能的系统研究In0.53Ga0.47As外延层

摘要

In this work, we present the results of an investigation into the effectiveness of varying ammonium sulphide (NH4)(2)S concentrations in the passivation of n-type and p-type In0.53Ga0.47As. Samples were degreased and immersed in aqueous (NH4)(2)S solutions of concentrations 22%, 10%, 5%, or 1% for 20 min at 295 K, immediately prior to atomic layer deposition of Al2O3. Multi-frequency capacitance-voltage (C-V) results on capacitor structures indicate that the lowest frequency dispersion over the bias range examined occurs for n-type and p-type devices treated with the 10% (NH4)(2)S solution. The deleterious effect on device behavior of increased ambient exposure time after removal from 10% (NH4)(2)S solution is also presented. Estimations of the interface state defect density (D-it) for the optimum 10% (NH4)(2)S passivated In0.53Ga0.47As devices extracted using an approximation to the conductance method, and also extracted using the temperature-modified high-low frequency C-V method, indicate that the same defect is present over n-type and p-type devices having an integrated D-it of similar to 2.5 x 10(12) cm(-2) (+/- 1 x 10(12) cm(-2)) with the peak density positioned in the middle of the In0.53Ga0.47As band gap at approximately 0.37 eV (+/- 0.03 eV) from the valence band edge. Both methods used for extracting D-it show very good agreement, providing evidence to support that the conductance method can be applied to devices incorporating high-k oxides on In0.53Ga0.47As. (C) 2011 American Institute of Physics. [doi: 10.1063/1.3533959]
机译:在这项工作中,我们介绍了对n型和p型In0.53Ga0.47As钝化中不同的硫化铵(NH4)(2)S浓度进行有效性研究的结果。紧接在原子层沉积Al2O3之前,将样品脱脂并浸入295 K浓度为22%,10%,5%或1%的(NH4)(2)S水溶液中20分钟。电容器结构上的多频电容-电压(C-V)结果表明,用10%(NH4)(2)S溶液处理过的n型和p型器件在所检查的偏置范围内出现最低的频率色散。还提出了从10%(NH4)(2)S溶液中移除后增加环境暴露时间对设备行为的有害影响。最佳10%(NH4)(2)S钝化的In0.53Ga0.47As器件的界面态缺陷密度(D-it)的估算,采用电导法的近似方法,并采用温度修正的高低频CV方法表示在集成D-it类似于2.5 x 10(12)cm(-2)(+/- 1 x 10(12)的n型和p型器件上存在相同的缺陷)cm(-2)),其峰值密度位于In0.53Ga0.47As带隙的中间,距价带边缘约0.37 eV(+/- 0.03 eV)。两种用于提取D-it的方法都显示出很好的一致性,为支持电导方法可应用于在In0.53Ga0.47As上掺入高k氧化物的器件提供了证据。 (C)2011美国物理研究所。 [doi:10.1063 / 1.3533959]

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