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Analysis of Nickel Sulphamate Bath Using Charging Current Compensated D.C. Polarography

机译:利用充电电流补偿的极谱法分析硫酸镍浴

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摘要

Metallic impurities such as copper, lead, iron, zinc, and cadmium are harmful in the nickel plating bath since they affect the properties of the deposit. The maximum tolerable limit is in the range of 10 to 200 ppm. Application of charging current compensated dc polarography (CCCDCP) to the analysis of trace impurities and nickel in a sulfamate bath is described.

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