首页> 美国政府科技报告 >Development of XRMF techniques for measurement of multi-layer film thicknesses on semiconductors for VLSI and ULSI integrated circuits. Final CRADA report for CRADA number Y-1292-0130
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Development of XRMF techniques for measurement of multi-layer film thicknesses on semiconductors for VLSI and ULSI integrated circuits. Final CRADA report for CRADA number Y-1292-0130

机译:开发用于测量VLsI和集成电路半导体多层膜厚度的XRmF技术.CRaDa编号Y-1292-0130的最终CRaDa报告

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A CRADA with Kevex Instruments was carried out to develop improved XRMF instrumentation for the nondestructive analysis of electronic components during manufacture. Experiments conducted at Y-12 proved the feasibility of a new Kevex x-ray tube design. Tests also show that the current commercial supply of straight glass capillaries is unreliable; however, other vendors of tapered single and multiple glass capillaries were identified. The stability of the Y-12 x-ray microprobe was significantly enhanced as a result of this CRADA.

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