Hot-Dip Tinning of Copper Hookup Wires. Part I. Properties of the Epsilon and eta'-Phases; Diffusion of Solid Copper into Liquid Tin; Calculation of the Diffusion Constants and Activation Energies

摘要

During hot-dip tin plating of copper wires an epsilon and an eta'-phase are formed; the following properties of which were determined; density, microhardness, wettability (wetting angle), and thermal conductivity. The phases were identified metallographically and by microprobe analysis. An experimental model was employed to assure the diffusion of copper into liquid tin and to determine the diffusion constant. The activation energy of diffusion was determined from the temperature dependence. (ERA citation 04:034166)