Development of New Low-Cost, High-Performance, PV Module Encapsulant/Packaging Materials: Final Technical Progress Report, 22 October 2002 - 15 November 2007

摘要

The primary objectives of this subcontract were to work with US-based photovoltaic (PV) module manufacturers representing crystalline silicon, amorphous silicon, copper indium diselenide (CIS), and other state-of-the-art thin-film technologies to develop and qualify new low-cost, high-performance PV module encapsulant/packaging materials, as well as the module production processes that utilize the packaging materials. The manufacturers assisted in the identification of candidate materials deficiencies while undergoing development, and then ultimately in the qualification of the final, optimized materials designed to specifically meet their requirements. Upon completion of this program, new low-cost, high-performance PV module encapsulant/packaging materials will be qualified, by one or more end-users, for their specific application. This document reports on progress toward these objectives and goals for the second phase of the three-phase subcontract.